公司介绍:公司为一家大型民企上市公司,主要产品为声学和光学相关产品。岗位职责:1.设计 Wire Bond 工艺方案,主导 Wire Bond 工艺开发及参数优化,确保相关性能满足产品规范;2.分析 Wire Bond 制程中的缺陷,提升良率和效率。3.培训生产团队掌握 Wire Bond 工艺操作技巧及异常处理流程。岗位要求:1. 本科及以上学历,微电子、材料科学与工程、电子封装、机械电子等相关专业。2. 5 年以上半导体封装行业经验,精通 Wire Bond 工艺及设备,熟悉金线键合工艺者优先。3. 深入理解 Wire Bond 材料特性及失效机理。4. 具备独立解决复杂工艺问题的能力,能适应快节奏研发与量产环境。5. 优秀的跨部门沟通能力,英语可读写技术文档
公司介绍:公司为一家大型民企上市公司,主要产品为声学和光学相关产品。岗位职责:1.设计 Wire Bond 工艺方案,主导 Wire Bond 工艺开发及参数优化,确保相关性能满足产品规范;2.分析 Wire Bond 制程中的缺陷,提升良率和效率。3.培训生产团队掌握 Wire Bond 工艺操作技巧及异常处理流程。岗位要求:1. 本科及以上学历,微电子、材料科学与工程、电子封装、机械电子等相关专业。2. 5 年以上半导体封装行业经验,精通 Wire Bond 工艺及设备,熟悉金线键合工艺者优先。3. 深入理解 Wire Bond 材料特性及失效机理。4. 具备独立解决复杂工艺问题的能力,能适应快节奏研发与量产环境。5. 优秀的跨部门沟通能力,英语可读写技术文档
About the Company:A foreign company Responsibilities:1. Interacted with customers, collected customer information, conducted task decomposition, information transmission, and customer service feedback to improve customer satisfaction2. Make agile development schedule, manage and monitor the implementation, and achieve according to the target3. Promote internal problem improvement and internal and external delivery of new product development4. Optimal mass
About the Company:A foreign company Responsibilities:1. Interacted with customers, collected customer information, conducted task decomposition, information transmission, and customer service feedback to improve customer satisfaction2. Make agile development schedule, manage and monitor the implementation, and achieve according to the target3. Promote internal problem improvement and internal and external delivery of new product development4. Optimal mass