advanced packaging specialist.

about the company.
Well-known comprehensive enterprise with strong technical strength

about the team.
There are many experts in the team, and their styles are more down-to-earth and simple.

about the job.

• Lead the development of innovative 3D integration packaging solutions, identifying critical process bottlenecks, and delivering end-to-end process flows, material specifications, and optimized methodologies.
• Drive strategic planning for next-generation 3D advanced packaging technologies, define development roadmaps, and collaborate with suppliers to advance tooling, equipment, and material capabilities for industry-leading system integration solutions.
• Expertise in Chip-to-Wafer Hybrid Bonding technology.

skills and experience required.

• Proven experience in 3D/advanced packaging R&D with a focus on process innovation and cross-functional delivery.
• Strong technical acumen in hybrid bonding, wafer-level integration, and supplier ecosystem collaboration.
• Familiarity with semiconductor manufacturing workflows and industry benchmarks.