About the Company：
A foreign company
Responsibilities：
1、Responsible for Die Bond (chip mounting) process development, parameter optimization and stability improvement to ensure chip mounting accuracy, bonding strength and reliability meet product requirements.
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2、Analyze process anomalies in the production process, formulate root cause analysis and corrective and preventive measures.
3、Lead cross-department cooperation to solve the yield, efficiency and reliability problems related to Die Bond.
4、Evaluate and introduce new Die Bond glue, solder, substrate material or equipment, complete DOE experiment design and process verification.
5、Assist product design team to optimize chip layout and package structure to improve process compatibility.
6、Trained the production and technical team to improve the overall process execution ability.artment goals.
Requirements：
1、Bachelor (> 5 years experience) or Master (> 2 years experience) equivalent in Polymer, Chemistry, or Material Science. The analytical ability is required.
2、Possess experience in two or more of the following technical areas is plus: polymer chemistry, polymer physics, polymer rheology, polymer adhesion, polymer formulation, polymer molding, or polymer characterization.
3、Proven communication skills and ability to perform within a cross-functional team environment.
4、Ability to drive change initiatives.
5、Interpersonal and communication skills.
