About the Company:A foreign company Responsibilities:1、Responsible for Die Bond (chip mounting) process development, parameter optimization and stability improvement to ensure chip mounting accuracy, bonding strength and reliability meet product requirements.2、Analyze process anomalies in the production process, formulate root cause analysis and corrective and preventive measures.3、Lead cross-department cooperation to solve the yield, efficiency and reliab
About the Company:A foreign company Responsibilities:1、Responsible for Die Bond (chip mounting) process development, parameter optimization and stability improvement to ensure chip mounting accuracy, bonding strength and reliability meet product requirements.2、Analyze process anomalies in the production process, formulate root cause analysis and corrective and preventive measures.3、Lead cross-department cooperation to solve the yield, efficiency and reliab